UP Bridge the Gap

UP at New York Maker Faire 2016

Post author:UP
Post published:October 10, 2016
Post category:Press release

UP Press Release: New York Maker Faire 2016 WORLD MAKER FAIRE, NEW YORK, Oct 2 2016 It all began with this question: “Is it possible to have a high performance…

UP Board with IMST LoRa® Gateway expansion

Post author:UP
Post published:July 19, 2016
Post category:Kickstarter / Press release

Once again, the UP Board bridges the gap between makers, innovators and the Internet of Things with the IMST LoRa® gateway expansion. (https://www.lora-alliance.org) This time we are working together with…

The UP board’s 45-day on Kickstarter

Post author:UP
Post published:December 4, 2015
Post category:Kickstarter / Press release

The Kickstarter campaign for the UP credit card size x86 computer board was successfully funded after it was announced on October 16th at the Maker Faire Rome event. The campaign…

the UP board collaboration with EnOcean

Post author:UP
Post published:November 23, 2015
Post category:Press release

EnOcean and ASUS company AAEON partner to bring energy harvesting wireless technology to makers The companies offer the makers community and software developers a comprehensive range of battery-less sensors and…

UP @ Rome Maker Faire

Post author:UP
Post published:October 16, 2015
Post category:Press release

MAKER FAIRE ROME, Italy, Oct 16 2015 - AAEON (ASUS group), Emutex and Intel today unveiled UP, the credit card size computer board for the professional maker market. Available in…