AAEON’s UP Brand Announces Four UP Edge PCs to Address Evolving Automation Needs
The UP TWL Edge, UP TWLS Edge, UP Squared TWL Edge and UP Squared Pro TWL Edge are designed to offer distinct advantages for different project needs. AAEON's UP…
The UP TWL Edge, UP TWLS Edge, UP Squared TWL Edge and UP Squared Pro TWL Edge are designed to offer distinct advantages for different project needs. AAEON's UP…
Modernize Automation with the New UP Edge Series You don’t have to sacrifice performance to achieve efficiency, and AAEON’s new UP Edge Series is proof. From the card-sized UP TWL…
The UP Xtreme ARL Edge: Deployment-ready from Day One The UP Xtreme ARL Edge is a ready-to-deploy, ruggedized system that harnesses the raw processing power and inferencing performance of Intel®…
Webinar hosted by Intel Corporation. UP AI Ecosystem can help accelerate Your AI Project Starting an AI project from scratch has never been easier…We’re excited to share with you that from…
AAEON’s UP Brand and Network Optix commit work towards a shared vision of democratizing access to edge AI and accelerate innovation. AAEON's UP brand, a leading designer and manufacturer of…
The compatibility between UP’s new dev kit range and Metis M.2 AI Inference Acceleration Card is set to give developers an unprecedented boost in AI performance on small-footprint hardware(Eindhoven, Netherlands…
Free Edge AI Toolkit for UP Platforms The new UP Edge AI Toolkit provides you with a comprehensive framework through which to build, convert, and deploy AI models across the…
Bridging the gap to the AI era, the UP Xtreme ARL redefines what’s possible as it takes its place as the most powerful developer board ever. Bringing Intel® Core™ Ultra…
Back in May, we introduced UP’s first NVIDIA-accelerated platform with Jetson Platform Services, built for industrial, deployment-ready modules.Now, we’re sharing even more ways to jump into AI: check out the…
The UP TWL, UP Squared Pro TWL, and UP Xtreme ARL AI Dev Kits pair multi-tiered Intel processing with both software suite and hardware bundles.(Eindhoven, Netherlands – September 1, 2025)…