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UP Xtreme i12
An innovative next generation developer board, the UP Xtreme i12 hosts the 12-core, 16-thread hybrid architecture of 12th Gen Intel® Core™ Processors (formerly Alder Lake-P). This configuration increases energy efficiency while doubling its predecessor’s thread count. With the built-in Intel® Iris® Xe graphics engine, it delivers greater performance and better efficiency for both general purpose applications and Artificial Intelligence (AI) on the edge. Thanks to the on board LPDDR5 memeory, it also provides greater processing power, doubling bandwidth and memory capacity without the need for SODIMM module installation. Combining this accelerated data processing with USB 4.0 and 2.5GbE ports ensures high-speed connectivity to peripheral cameras and sensors, making the UP Xtreme i12 the perfect board for smart retail. Additionally, the 2.47 x increase in graphics speed provided by Intel® Iris® Xe graphics, with four simultaneous 4K displays.
Further, the UP Xtreme i12’s wide 12 – 36V power input range facilitates extended use for industrial applications, such as smart manufacturing. Customers can therefore harness CPU performance up to 20% greater than Tiger Lake while retaining continuous, efficient operation in more challenging environments.
Key Strengths
Powerful
The latest 12th Gen Intel® Core™ processor with Intel Iris Xe graphic (formerly Alder Lake-P). Supports up 12 cores, 4.5 GHz with 20% higher performance than previous generation.
Graphic
Intel® Iris® Xe graphics provide up to 96EU, which is nearly twice the performance of corresponding Ice Lake Gen 11 at the same TDP, with four simultaneous 4K displays.
Multiple display connector options with 1x HDMI 2.0b, 1x DP 1.4a, 1x DP 1.4a via USB Type C and 1x eDP 1.4b
Faster
On board dual channel LPDDR5 up to 32GB, provides higher performance and efficiency
USB 4.0 Type C with higher performance and data transfer speed
5G supported for ultra-reliable low latency communications
Intel® Ethernet Controller i226 runs 2.5 Gbps Speed with Time-Sensitive Networking (TSN) support
Expandable
Flexible expandability with 40-pin HAT. Provides 28x GPIO, 1x SPI, 2x I2C, 1x ADC, 1x I2S, 2x PWM, 1x UART, 3V3, 5V, GND.
2x M.2 2280 M-key slot with PCIe Gen 4×4 for NVMe SSD storage and AI module expansion.
M.2 2230 E-key slot for WiFi/ BT module and M.2 3052 B-key slot for 4G/LTE/5G module expansion.
AI Ready
Its AI performance is augmented by Intel® DL Boost and the Intel® distribution of OpenVINO™ toolkit, which yields up to 2.81 x the GPU image classification inferencing performance of the previous generation.
Optimize resource allocation for AI interference at the edge via Intel® Distribution of OpenVINO™ toolkit across CPU and GPU.
Optional AI module expansion via M.2 slots.
Industrial & Secure
UP Xtreme i12 has upgraded the power input to 12-36V DC-in for industrial applications.
Hardware TPM v2.0 onboard.
2x RS-232/422/485 COM port expansion via wafers
3.5mm audio jack with mic-in and line out for audio application
Board 
System Board
Board Details
Hardware overview
- UP Xtreme i12, powered by the 12th generation Intel® Core™ i7/i5/i3/Celeron® Processor SoC (formerly Alder Lake-P)
- Intel® Iris Xe (Intel® Core™ i5 & Intel® i7)/ Intel® UHD Graphics (Intel® Core™ i3 & Intel® Celeron®)
- 1x Active heatsink
- 1x RTC battery
Tech Specifications
| SoC | Intel® Core™ i7-1270PE (12 cores, up to 4.50 GHz), Intel® Core™ i5-1250PE (12 cores, up to 4.40 GHz), Intel® Core™ i3-1220PE (8 cores, up to 4.20 GHz), Intel® Celeron® Processor 7305E (5 cores, up to 1.00 GHz) (formerly Alder Lake P) |
| # of Cores | Up to 12 cores |
| Graphics | Intel® Iris® Xe (Intel® Core™ i5 & Intel® i7)/ Intel® UHD Graphics (Intel® Core™ i3 & Intel® Celeron®) |
| System memory | Up to 16GB LPDDR5 |
| Storage capacity | via SATA or M.2 2280 NVMe* |
| FPGA | Lattice |
| BIOS | UEFI |
| RTC | Yes |
| Wake-on-LAN (WoL) | Yes |
| Watchdog timer | Yes |
| PXE | Yes |
| TPM | TPM 2.0 on board |
| Compatible operating system | Microsoft Windows 10 Enterprise 2021 LTSC, Linux (Ubuntu, Yocto) |
| Dimension (L x W) | 4.7″ x 4.8″ (120.35 mm × 122.5 mm) |
| Display | |
| HDMI | 1x HDMI 2.0b |
| DP | 1x DP 1.4a 1x DP 1.4b via USB Type-C |
| MIPI DSI/eDP | 1x eDP 1.4b |
| I/O | |
| USB | 2x USB 2.0 via 10-pin wafer 1x USB 2.0 Type-A 3x USB 3.2 Gen 2 Type-A 1x USB 4.0 Type-C |
| Audio | 1x Audio Jack (Mic-in/ line out) |
| Camera | MIPI-CSI via 61-pin FPC |
| UART | 1x HSUART via 10-pin wafer |
| Serial port | 2x RS-232/422/485 10-pin header |
| Expansion slot | 1x M.2 2230 E key (PCIe/ USB), 2x M.2 2280 M key (PCIe Gen 4[x4]), 1x M.2 3052 B Key (PCIe/ USB 3.0) with Nano SIM slot |
| 40-pin HAT | 1 |
| 100-pin GP bus | N/A |
| Connectivity | |
| Ethernet | 1x GbE (Intel® i219) 1x 2.5GbE (Intel® i226IT) |
| WiFi 5/6 | Optional (via. M.2 2230 E Key slot) |
| Bluetooth | Optional (via. M.2 2230 E Key slot) |
| LTE/4G/ 5G | Optional (via. M.2 3052 B Key slot) |
| Power | |
| Power requirement | 12V – 36V DC-in @ 6A |
| Power Supply Type | AT/ATX |
| Power consumption (typical) | Intel® Core™ i7-1270PE, LPDDR5 4800MHz 16GB, 5.86A@+ 12V (Typical) |
| Environmental & Certification | |
| Cooling | Active cooling |
| Operating temperature | 32°F ~ 140°F (0°C ~ 60°C) |
| Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
| Operating humidity | 0% ~ 90% relative humidity, non-condensing |
| MTBF (hours) | 362,068 |
| Certification | CE/FCC Class A, RoHS compliant |
| Longevity | |
| Longevity | 2037 |
Expansions
System
Edge Details
Hardware overview
- UP Xtreme i12 Edge with the latest Intel® 12th Gen Core SoC, up to 4.5GHz
- Intel Core i7- 1270PE
- Intel Core i5- 1250PE
- Intel Core i3- 1220PE
- Intel Celeron® Processor 7305E
- Intel® UHD Graphics (Celeron/ Core™ i3) / Intel® Iris Xe (Core™ i5 & i7)
Tech Specifications
| UP board version | Up Xtreme i12 Edge |
| SoC | Intel Core i7-1270PE Intel Core i5-1250PE Intel Core i3-1220PE Intel Core Celeron-7305E |
| VPU | Optional via M.2 2280 |
| Graphics | Intel® Iris® Xe graphics |
| FPGA | Lattice |
| System memory | Onboard LPDDR5 Dual Channel up to 32GB |
| Storage capacity | 2x M.2 2280 (PCIe Gen4.0 x 4) M-key 1x SATA3 |
| BIOS | UEFI |
| Compatible operating system | Windows* 10 Enterprise 2021 LTSC Ubuntu 22.04 Yocto 4.0 |
| Power | 12-36 V DC-IN (lockable connector) |
| Power supply type | AT/ATX |
| Power consumption (typical) | Intel® Core™ i7-1270PE, LPDDR5 4800MHz 16GB, 5.86A@+ 12V (Typical) Intel® Core™ i7-1270PE, LPDDR5 4800MHz 16GB, 8.05A@+ 12V (Max) |
| Operating temperature | 0˚C – 60˚C degree with air flow 0.5m/s |
| Storage Temperature | -40˚F ~ 176˚F (-40˚C ~ 80˚C) |
| Operating humidity | 0% ~ 90% relative humidity, non-condensing |
| Certification | CE/FCC Class A, RoHS Compliant, REACH |
| RTC | YES |
| Cooling | Fanless |
| Country of origin | Taiwan |
| Longevity | 2037 |
| Display | |
| HDMI | 1x HDMI 2.0b |
| DP | 1x DP 1.4a + 1x DP 1.4a via USB type C |
| MIPI DSI/ eDP | 1x eDP (4K@60hz) |
| I/O | |
| Audio | 1x Audio Jack (Mic-in, Line out) |
| Camera | MIPI-CSI via 61-pin FPC |
| USB | 3x USB3.2 Gen2 Type A 1x USB2.0 Type A 1x USB4.0 Type C |
| UART | 1x HSUART (pin header) |
| Serial port | 2x RS232/422/485 |
| HDD interface | 1x SATA 3.0 |
| Expansion slot | 1x M.2 2230 E-key 2x M.2 2280 (PCIe Gen4.0 x 4) M-key 1x SATA3 1x M.2 3052 B-key |
| SIM slot | 1x Nano SIM slot |
| Others | Phoenix: 3V3, 5V, GND, I2C, 8x GPIO, 2x PWM Infineon TPM SLB9670 on board |
| Connectivity | |
| Ethernet | 1x Intel i226IT (TSN) / 1x Intel i219 (vPRO) |
| WiFi | Optional via M.2 2230 |
| Bluetooth | Optional via M.2 2230 |
| LTE/4G/5G | Optional (via M.2 3052) |
| Package | |
| Net weight | 1.34kg |
| Gross weight | 1.76kg |
| Product dimension | 152 x 123.8 x 71.5 mm |
Choose Your SKU
Intel
Core™
i7-1185GRE
HIGH PERFORMANCE
-
15W TDP
-
-40 to 100°C Temp. Range
-
4 Cores
-
1.8 GHz (Turbo up to 4.4 GHz)
-
Intel® Iris® Xe Graphics 96EU
-
In-Band ECC
-
Intel® Programmable Services
Engine (PSE)1 -
Intel® Time-Coordinated
Computing (TCC) -
TPM 2.0 on board
Intel
Atom®
x6425RE
ENTRY LEVEL
-
12W TDP
-
-40 to 85°C Temp. Range
-
4 Cores
-
1.9 GHz
-
Intel® UHD Graphics 32EU
-
In-Band ECC
-
Intel® Programmable Services
Engine (PSE)2 -
Intel® Time-Coordinated
Computing (TCC) -
TPM 2.0 on board
What can you achieve with this kit?
Live Test of Robotic Operation Applications
Run sample applications to perform robotic operations such as object detection, simultaneous localization and mapping (SLAM), navigation, and object avoidance.
Evaluate Applications for Optimization
Collect benchmark data, perform experiments, and evaluate applications as they are developed to optimize any applications running on EI for AMR solutions.
Customize Reference Software for Autonomous Mobile Robots
Modify reference software with artificial intelligence and SLAM algorithms or replace software modules with custom solutions to meet your application needs.
Vertical Markets
- Supports standard industry 12V~36V power input and power connector
- 2x RS-232/422/485 COM Port
- Multiple flexible I/O interfaces including GPIO, UART, I2C, USB and WiFi/BT expansion with M.2 slot.
- Delivers reliable real-time performance with 2.5GbE LAN port and Time Sensitive Networking (TSN)
- Up to 4x independent displays with efficient video analytics to leverage end user’s shopping behaviour
- Powerful AI graphic engine with Intel® distribution of OpenVINO™ toolkit support
- AI and IoT enabled for better logistical operations and marketing strategies
Audio mic-in/out wafer for automated audio kiosks and operations
Block diagram
Community Support
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◉ UP Xtreme i12
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