Intel certified Developer Kit, powered by Intel® SoC.

UP Xtreme i12

An innovative next generation developer board, the UP Xtreme i12 hosts the 12-core, 16-thread hybrid architecture of 12th Gen Intel® Core™ Processors (formerly Alder Lake-P). This configuration increases energy efficiency while doubling its predecessor’s thread count. With the built-in Intel® Iris® Xe graphics engine, it delivers greater performance and better efficiency for both general purpose applications and Artificial Intelligence (AI) on the edge. Thanks to the on board LPDDR5 memeory, it also provides greater processing power, doubling bandwidth and memory capacity without the need for SODIMM module installation. Combining this accelerated data processing with USB 4.0 and 2.5GbE ports ensures high-speed connectivity to peripheral cameras and sensors, making the UP Xtreme i12 the perfect board for smart retail. Additionally, the 2.47 x increase in graphics speed provided by Intel® Iris® Xe graphics, with four simultaneous 4K displays.

Further, the UP Xtreme i12’s wide 12 – 36V power input range facilitates extended use for industrial applications, such as smart manufacturing. Customers can therefore harness CPU performance up to 20% greater than Tiger Lake while retaining continuous, efficient operation in more challenging environments.

Key Strengths


The latest 12th Gen Intel® Core™ processor with Intel Iris Xe graphic (formerly Alder Lake-P). Supports up 12 cores, 4.5 GHz with 20% higher performance than previous generation.


Intel® Iris® Xe graphics provide up to 96EU, which is nearly twice the performance of corresponding Ice Lake Gen 11 at the same TDP, with four simultaneous 4K displays.
Multiple display connector options with 1x HDMI 2.0b, 1x DP 1.4a, 1x DP 1.4a via USB Type C and 1x eDP 1.4b


On board dual channel LPDDR5 up to 32GB, provides higher performance and efficiency
USB 4.0 Type C with higher performance and data transfer speed
5G supported for ultra-reliable low latency communications
Intel® Ethernet Controller i226 runs 2.5 Gbps Speed with Time-Sensitive Networking (TSN) support



Flexible expandability with 40-pin HAT. Provides 28x GPIO, 1x SPI, 2x I2C, 1x ADC, 1x I2S, 2x PWM, 1x UART, 3V3, 5V, GND.
2x M.2 2280 M-key slot with PCIe Gen 4×4 for NVMe SSD storage and AI module expansion.
M.2 2230 E-key slot for WiFi/ BT module and M.2 3052 B-key slot for 4G/LTE/5G module expansion.

AI Ready

Its AI performance is augmented by Intel® DL Boost and the Intel® distribution of OpenVINO™ toolkit, which yields up to 2.81 x the GPU image classification inferencing performance of the previous generation.
Optimize resource allocation for AI interference at the edge via Intel® Distribution of OpenVINO™ toolkit across CPU and GPU.
Optional AI module expansion via M.2 slots.

Industrial & Secure

UP Xtreme i12 has upgraded the power input to 12-36V DC-in for industrial applications.
Hardware TPM v2.0 onboard.
2x RS-232/422/485 COM port expansion via wafers
3.5mm audio jack with mic-in and line out for audio application

Choose Your SKU


  • 15W TDP
  • -40 to 100°C Temp. Range
  • 4 Cores
  • 1.8 GHz (Turbo up to 4.4 GHz)
  • Intel® Iris® Xe Graphics 96EU
  • In-Band ECC
  • Intel® Programmable Services
      Engine (PSE)1
  • Intel® Time-Coordinated
      Computing (TCC)
  • TPM 2.0 on board


  • 12W TDP
  • -40 to 85°C Temp. Range
  • 4 Cores
  • 1.9 GHz
  • Intel® UHD Graphics 32EU
  • In-Band ECC
  • Intel® Programmable Services
      Engine (PSE)2
  • Intel® Time-Coordinated
      Computing (TCC)
  • TPM 2.0 on board

What can you achieve with this kit?

Live Test of Robotic Operation Applications

Run sample applications to perform robotic operations such as object detection, simultaneous localization and mapping (SLAM), navigation, and object avoidance.

Evaluate Applications for Optimization

Collect benchmark data, perform experiments, and evaluate applications as they are developed to optimize any applications running on EI for AMR solutions.

Customize Reference Software for Autonomous Mobile Robots

Modify reference software with artificial intelligence and SLAM algorithms or replace software modules with custom solutions to meet your application needs.

Intel® RealSense™ depth camera D435i as input for the SLAM

Vertical Markets

  • Supports standard industry 12V~36V power input and power connector
  • 2x RS-232/422/485 COM Port
  • Multiple flexible I/O interfaces including GPIO, UART, I2C, USB and WiFi/BT expansion with M.2 slot.
  • Delivers reliable real-time performance with 2.5GbE LAN port and Time Sensitive Networking (TSN)
  • Up to 4x independent displays with efficient video analytics to leverage end user’s shopping behaviour
  • Powerful AI graphic engine with Intel® distribution of OpenVINO™ toolkit support
  • AI and IoT enabled for better logistical operations and marketing strategies
    Audio mic-in/out wafer for automated audio kiosks and operations

Block diagram

Community Support

UP Community

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UP Wiki

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Find out the pinout and its pin-function here:
UP Xtreme i12

UP Downloads

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