UP Core Series

The x86 industrial maker board even smaller than a Post-it!

The extremely compact form factor, expandability through the 100-pin expansion connector and reliability of the Intel Atom x86 processor platform make UP core the perfect platform for your solution.
Thousands of makers and developers have succesfully brought their ideas to live.

Key Strengths

Powerful

Powered by Intel® Atom™ x5-Z8350 QuadCore 1.44/1.92Ghz 64 bit CPU, UP Core comes with with 2/4GB RAM, 32GB/64GB eMMC 5.0, 2 x USB 2.0, USB 3.0, HDMI, DSI/eDP, 2 x MIPI-CSI supporting 2M Pixel camera and 8M Pixel camera, WiFi 802.11 b/g/n, Bluetooth 4.2 with Ampak AP6214 on board.

Smallest Quad-core x86 SBC

It is smaller than a post-it, and it can be expanded or stacked to extend many more functionalities. At a limited size of 56.5x 66mm, be prepared to experience the unlimited possibilities of UP Core.

Expandable

On the underside of UP Core, there is a 100 pin I/O high-speed expansion connector with UART, SPI, 2x USB HSIC, PCI-Express, GPIO, Intel Sensors Hub, SDIO and 5V Power. This permits users to expand the features, easily developing custom expansion boards.

Board Details

Hardware overview

  • UP Core Series with Atom® x5-Z8350 QuadCore 1.92Ghz 64 bit CPU
  • Intel® HD 400 Graphics
  • 100-pin expansion

Tech Specifications

UP Core Board Overview
UP board versionUP Core
SoCIntel Atom® x5-Z8350 (up to 1.92 GHz)
VPUN/A
GraphicsIntel® HD 400 Graphics
FPGAN/A
System memory1GB
2GB
4GB
Storage capacity16GB
32GB
64GB
BIOSUEFI
Compatible operating systemMicrosoft Windows 10 full version, Linux (ubilinux, Ubuntu, Yocto), Android
Power5V DC-in @ 4A 5.5/2.1mm jack
1x Power Button / LED
Power supply typeAT/ATX (default AT mode)
Power consumption (typical)13W
Operating temperature0°C-60°C (32°F ~ 140°F)
Storage Temperature-40°C ~ 80°C (-40°F ~ 176°F)
Operating humidity0% ~ 90% relative humidity, non-condensing
CertificationCE/FCC Class A
RTCYES
HS code8473308000
CoolingFanless
Country of OriginTaiwan
Longevity2024
Display
HDMI1 (HDMI 1.4a)
DPN/A
MIPI DSI/ eDP1x eDP
I/O
AudioI2S audio port
USB1x UB3.0 Type A
2x USB2.0 pin header
UART2x UART (Tx/Rx) debug port (pin header)
Serial portN/A
HDD interfaceN/A
Expansion Slot100-pin docking connector
SIM slotN/A
Connectivity
EthernetN/A
WiFiWiFi 802.11 b/g/n @ 2.4 GHz (AMPAK.AP6214A)
BluetoothBluetooth 4.0 (BLE)
LTE/4G/ 5GN/A
Package
Net weight52.5g
Gross weight74.2g
Product dimension56.5mm x 66mm (2.2″ x 2.5″)

Expansions

 ▶ Add UP High-speed carrier board
 for 1x GbLAN port, 1x PCIe switch, 1 x HSIC for USB to 3x USB ports
 (1x minicard, 2x connectors), 1x mini card, 2x USB 2.0, etc.
 ▶ Add UP Low-speed carrier board
 for RS232/422/485, 1x horizontal 30-pin wafer box header for HAT 40-pin IO
 (GPIO, UART, I2C, SPI, PWM, I2S), etc

System Details

Hardware overview

  • UP Core with the Intel Atom® x5-Z8350 Processor (up to 1.92 GHz)
  • Intel® HD 400 Graphics
  • 4GB RAM
  • 32GB
  • WiFi 802.11 b/g/n @ 2.4 GHz
  • Bluetooth 4.0 (BLE)
  • Optimized Fan-less Cooling Design
  • CE/FCC certified

Tech Specifications

UP Core Gateway
UP board versionUP Core
SoCIntel Atom® x5-Z8350 Quad Core Processor (up to1.92 GHz)
VPUN/A
GraphicsIntel® HD 400 Graphics
FPGAN/A
System memory4GB
Storage capacity32GB
BIOSUEFI
Compatible operating systemMicrosoft Windows 10 full version, Linux (ubilinux, Ubuntu, Yocto), Android
Power5V DC-in @ 4A 5.5/2.1mm jack
1x Power Button / LED
Power supply typeAT/ATX
Power consumption (typical)13W
Operating temperature0°C-40°C (32°F ~ 104°F)
Storage Temperature-40°C ~ 80°C (-40°F ~ 176°F)
Operating humidity0% ~ 90% relative humidity, non-condensing
CertificationCE/FCC Class A
RTCYES
HS code8473308000
CoolingFanless
Country of OriginTaiwan
Longevity2024
Display
HDMI1 (HDMI 1.4a)
DPN/A
MIPI DSI/ eDP1x eDP
I/O
AudioN/A
USB1x UB3.0 Type A
UARTN/A
Serial port1x RS-232/422/485
HDD interfaceN/A
Expansion SlotN/A
SIM slotN/A
Connectivity
Ethernet1x GbLAN (Realtek RTL8111G-CG)
WiFiWiFi 802.11 b/g/n @ 2.4 GHz
BluetoothBluetooth 4.0 (BLE)
LTE/4G/ 5GN/A
Package
Net weight350g
Gross weight700g
Product dimension56.5 x 66 (2.2″ x 2.5″)

Add-ons

Stackable expansion boards

High-speed carrier board – it offers signals such as PCI-express, GbLAN and USB3.0. Low-speed carrier board – it offers signals such as RS-232/422/484, I2C, I2S, and GPIO. You may choose either one of the two boards or stack both of them beneath UP Core. The high-speed signal expansion board shall always be the first layer beneath UP Core if you intend to use up to 3 expansion boards. All our users can take advantage of those existing designs to make your own expansion boards.

What can you achieve with this kit?

Here we demo UP Core with RealSense camera and SLAM library for robotics – With embedded vision, you can choose Basler camera with pylon SDK and together with this, there are many more partners in home automation, industrial automation and IoT.

UP Core enables you to utilize the entire eco-system which we have built around the UP Board and UP Squared. Whether you are working in the fields of industrial automation, vending, digital signage, IoT, home automation or robotics; there are options for you within our ecosystem. Many talented people have been working hard to lay down the foundation for your current and future projects.

Block Diagram

Community Support

UP Community

Join our developer community and share your knowledge about UP. Stuck with your project? Get help from one of the hundreds of industry professions that are already using UP!

UP Wiki

Learn more about UP with code and project examples, tutorials and OS installation guides

UP Downloads

Download everything you need to start your project. Our download area includes drivers, OS image, 2D/3D drawings, environment test reports, certifications and more.