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UP Squared Pro 7000
The newest 3rd generation lineup to the UP Squared Pro series, the UP Squared Pro 7000 is powered by the Intel Atom® x7000E Series, Intel Atom ® x7000RE, Intel® Processor N-series, and Intel® Core™ i3-N305 Processor (formerly Alder Lake N).
Featuring improved performance, higher graphics capability, and expanded support for more connectivity and interfaces, the UP Squared Pro 7000 is ideal for Pro Makers to build solutions for the edge.
Based on the latest the Intel Atom® x7000E Series, Intel® Processor N-series, and Intel® Core™ i3-N305 Processor (formerly Alder Lake N), UP Squared Pro 7000 offers up to 1.4x better compute performance and twice the performance for 3D graphics compared with the previous generation Intel® Pentium® CPU SKU in single thread.
The UP Squared Pro 7000 is suitable for efficient solutions at the edge, such as visual and transactional retail, education, and office automation. Combined with industrial features such as Time-Sensitive Networking (TSN), Time-Coordinated Computing (TCC)*, in-band ECC*, and onboard TPM 2.0, the UP Squared Pro 7000 is also built for automation, robotics, and industrial applications.
UP Squared Pro 7000 brings 5G connectivity, a flexible I/O loadout, and powerful computing to an impressive power-efficient platform. With more expandability, flexibility, and industrial features than ever before, the UP Squared Pro 7000 brings edge computing to the next level.
Key Strengths
Powerful
UP Squared Pro 7000 is powered by the Intel Atom® x7000E Series, Intel® Processor N-series, and Intel® Core™ i3-N305 Processor (formerly Alder Lake N), which combines high performance with low-power consumption. Featuring a 64-bit quad-core system-on-chip (SoC) with up to 8 cores and clocks up to 3.8GHz yet with a TDP between 9W to 15W, the processor delivers up to 1.4× compute performance improvement over the previous generation.
The pre-validated software: Intel EI for AMR helps to orchestrate each hardware component to minimize evaluation time and integration development.
The Intel® Edge Insights for Autonomous Mobile Robots (Intel® EI for AMR) software package is prevalidated on the UP Squared Pro 7000. Together with sample applications, this combination of hardware and software helps developers speed up building an AMR solution and accelerate time to market.
High-End Graphics
- Enhanced media and AI capability with the integrated Intel® UHD Graphics Gen 12, which is based on Intel Xe Architecture.
- up to 32 Execution Units (EU) available for AI inference
- up to 3 simultaneous displays (up to 4K)
- up to 3.5× graphics improvements in the ML benchmark compared with the previous generation
- supports major AI datatypes including INT8
- Up to 3 independent 4K60 displays (supports Pipelock that synchronize 2 outputs (Digital Display Interfaces) under Windows Operating System) and Graphic Virtualization.
- Up to 3.5x performance improvement for the ML benchmark.
- Support for major AI datatypes including INT8.
Industrial & Secure
- Supports industry standard 12 V power input
- Delivers reliable real-time performance with Intel® Time Coordinated Computing (Intel® TCC), Time Sensitive Networking (TSN), and In-Band Error Correction Code (IBECC)
- Industrial I/O: 1x 40-pin HAT with GPIO, 2× RS-232/422/485 pin header
- Cost effective: Intel® In-Band ECC* prevents data corruption without using ECC memory
- Hardware TPM 2.0 on board
Expandable
- 1x M.2 2230 E-key (CNVI, PCIe and USB) for WiFi/ BT
- 1x M.2 2280 M-key for AI/ Storage
- 1x M.2 3052 B-key for 5G
- 40-pin HAT with various I/Os including GPIO, SPI, I2C, I2S, ADC, PWM and UART
New Features
- First entry platform supports dual-channel LPDDR5 memory, up to 16GB.
- MIPI-CSI interface with 60-pin connector.
- Up to 2x 2.5GbE with Time Sensitive Networking (TSN) technology.
Industrial Use Cases
- The UP Squared Pro 7000 is the perfect fit for those seeking an entry level SBC for core industrial use cases
- Also built for automation, robotics, and industrial applications
Board 
Edge 
Edge Computing Kit Board
Board Details
Hardware overview
- UP Squared Pro 7000 Series board
- Intel® UHD Graphics
- 1x Passive heatsink
- 1x RTC battery
Tech Specifications
| SoC | Intel® Core™ i3-N305 / Intel Atom® x7425E / Intel® Processor N97 / Intel® Processor N50 (formerly Alder Lake N) |
| # of Cores | Up to 8 cores |
| Graphics | Intel® UHD Graphics Gen 12 |
| System memory | Up to 16GB LPDDR5 |
| Storage capacity | Up to 64GB eMMC 1x M.2 2280 M-key (PCIe Gen 3 x2, USB2.0) 1x SATA3 Port |
| BIOS | UEFI |
| RTC | Yes |
| Wake-on-LAN (WoL) | Yes |
| Watchdog timer | Yes |
| PXE | Yes |
| TPM | TPM 2.0 on board |
| Compatible operating system | Microsoft Windows 10 IOT Enterprise, Windows IoT Core, Linux (Ubuntu 22.04, Yocto 4) |
| Dimension (L x W) | 4″ x 4″ (101.6 mm × 101.6 mm) |
| Display | |
| HDMI | 1x HDMI 2.0b |
| DP | 1x DP 1.2 1x DP 1.4a via USB Type-C |
| eDP | – |
| I/O | |
| USB | 2x USB 2.0 via 10-pin wafer 2x USB 3.2 Gen 2 Type-A 1x USB 3.2 Gen 2 Type-C |
| Audio | 1x Audio Jack (Mic-in/ line out) |
| Camera | 2x 4-Lane MIPI-CSI via 61pin FPC connector |
| UART | 1x UART via 10-pin wafer |
| Serial port | 2x RS-232/422/485 via 10-pin header |
| Expansion slot | 1x M.2 2230 E-key (CNVI , PCIe Gen 3 x1, USB2.0) 1x M.2 2280 M-key (PCIe Gen 3 x2, USB2.0) 1x M.2 3052 B-key (USB3.2 Gen 2 only) |
| 40-pin HAT | 1 |
| 100-pin GP bus | N/A |
| Connectivity | |
| Ethernet | 2x 2.5GbE (Intel® i226-IT) |
| WiFi 5/6 | Optional (via. M.2 2230 E Key slot) |
| Bluetooth | Optional (via. M.2 2230 E Key slot) |
| LTE/4G/ 5G | Optional (via. M.2 3052 B Key slot) |
| Power | |
| Power requirement | 12V DC-in @ 6A |
| Power Supply Type | AT/ATX (default AT mode) |
| Power consumption (typical) | Intel® Core™ i3-N305: 9 – 15W Intel Atom® x7425E: 12W Intel® Processor N97: 12W Intel® Processor N50: 6W |
| Environmental & Certification | |
| Cooling | Fanless |
| Operating temperature | 32°F ~ 140°F (0°C ~ 60°C) |
| Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
| Operating humidity | 0% ~ 90% relative humidity, non-condensing |
| MTBF (hours) | 422053 |
| Certification | CE/FCC Class A, RoHS Compliant, REACH |
| Longevity | |
| Longevity | 2038 |
Edge
Edge Details
Hardware overview
- UP Squared Pro 7000 with the Intel Atom® x7000E Series, Intel® Processor N-series, and Intel® Core™ i3-N305 Processor (formerly Alder Lake)
- Intel® UHD Graphics
- 1x fanless chassis
- 1x RTC battery
Tech Specifications
| SoC test | Intel® Core™ i3-N305 / Intel Atom® x7425RE / Intel® Processor N97 / Intel® Processor N50 (formerly Alder Lake N) |
| # of Cores | Up to 8 cores |
| Graphics | Intel® UHD Graphics Gen 12 |
| System memory | Up to 16GB LPDDR5 |
| Storage capacity | Up to 64GB eMMC 1x M.2 2280 M-key (PCIe Gen 3 x2, USB2.0) 1x SATA3 Port |
| BIOS | UEFI |
| RTC | Yes |
| Wake-on-LAN (WoL) | Yes |
| Watchdog timer | Yes |
| PXE | Yes |
| TPM | TPM 2.0 on board |
| Compatible operating system | Microsoft Windows 10 IOT Enterprise, Windows IoT Core, Linux (Ubuntu 22.04, Yocto 4) |
| Dimension (L x W) | 4″ x 4″ (101.6 mm × 101.6 mm) |
| Display | |
| HDMI | 1x HDMI 2.0b |
| DP | 1x DP 1.2 1x DP 1.4a via USB Type-C |
| MIPI DSI/eDP | N/A |
| I/O | |
| USB | 2x USB 2.0 via 10-pin wafer 2x USB 3.2 Gen 2 Type-A 1x USB 3.2 Gen 2 Type-C |
| Audio | 1x Audio Jack (Mic-in/ line out) |
| Camera | 2x 4-Lane MIPI-CSI via 61pin FPC connector |
| UART | 1x UART via 10-pin wafer |
| Serial port | 2x RS-232/422/485 |
| Expansion slot | 1x M.2 2230 E-key (CNVI , PCIe Gen 3 x1, USB2.0) 1x M.2 2280 M-key (PCIe Gen 3 x2, USB2.0) 1x M.2 3052 B-key (USB3.2 Gen 2 only) |
| 40-pin HAT | 1 |
| 100-pin GP bus | N/A |
| Connectivity | |
| Ethernet | 2x 2.5GbE (Intel® i226-IT) |
| WiFi 5/6 | Optional (via. M.2 2230 E Key slot) |
| Bluetooth | Optional (via. M.2 2230 E Key slot) |
| LTE/4G/ 5G | Optional (via. M.2 3052 B Key slot) |
| Power | |
| Power requirement | 12V DC-in @ 6A |
| Power Supply Type | AT/ATX (default AT mode) |
| Power consumption (typical) | Intel® Core™ i3-N305: 9 – 15W Intel Atom® x7425RE: 12W Intel® Processor N97: 12W Intel® Processor N50: 6W |
| Environmental & Certification | |
| Cooling | Fanless |
| Operating temperature | 32°F ~ 140°F (0°C ~ 60°C) |
| Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
| Operating humidity | 0% ~ 90% relative humidity, non-condensing |
| MTBF (hours) | 422053 |
| Certification | CE/FCC Class A, RoHS Compliant, REACH |
| Longevity | |
| Longevity | 2038 |
Expansions
Edge Computing Kit
UP Squared Pro 7000 Edge Computing Kit Details
Hardware overview
- UP Squared Pro 7000 main board with the Intel Atom® x7000E Series, Intel® Processor N-series, and Intel® Core™ i3-N305 Processor, 1.9 GHz
- Intel® UHD Graphics
- 1x passive heatsink
- 1x RTC battery
- 1x 12V6A (72W) Power Supply
- 1x US power cord + 1x EU power cord
Software overview
|
|
Tech Specifications
| SoC | Intel® Core™ i3-N305 / Intel Atom® x7425RE / (formerly Alder Lake N) |
| # of Cores | 8 cores (Intel® Core™ i3-N305 SKU) 4 cores (Intel Atom® x7425RE) |
| Graphics | Intel® UHD Graphics Gen 12 |
| System memory | 16GB LPDDR5 (Intel® Core™ i3-N305 SKU) 8GB LPDDR5 (Intel Atom® x7425RE) |
| Storage capacity | 64GB eMMC 1x M.2 2280 M-key (PCIe Gen 3 x2, USB2.0) 1x SATA3 Port |
| BIOS | UEFI |
| RTC | Yes |
| Wake-on-LAN (WoL) | Yes |
| Watchdog timer | Yes |
| PXE | Yes |
| TPM | TPM 2.0 on board |
| Pre-installed operating system | Microsoft Windows 10 full version, Windows IoT Core, Linux (Ubuntu 22.04, Yocto) |
| Dimension (L x W) | 4″ x 4″ (101.6 mm × 101.6 mm) |
| Display | |
| HDMI | 1x HDMI 2.0b |
| DP | 1x DP 1.2 1x DP 1.4a via USB Type-C |
| MIPI DSI/eDP | N/A |
| I/O | |
| USB | 2x USB 2.0 via 10-pin wafer 2x USB 3.2 Gen 2 Type-A 1x USB 3.2 Gen 2 Type-C |
| Audio | 1x Audio Jack (Mic-in/ line out) |
| Camera | 2x 4-Lane MIPI-CSI via 61pin FPC connector |
| UART | 1x UART via 10-pin wafer |
| Serial port | 2x RS-232/422/485 |
| Expansion slot | 1x M.2 2230 E-key (CNVI , PCIe Gen 3 x1, USB2.0) 1x M.2 2280 M-key (PCIe Gen 3 x2, USB2.0) 1x M.2 3052 B-key (USB3.2 Gen 2 only) |
| 40-pin HAT | 1 |
| 100-pin GP bus | N/A |
| Connectivity | |
| Ethernet | 2x 2.5GbE (Intel® i226-IT) |
| WiFi 5/6 | Optional (via. M.2 2230 E Key slot) |
| Bluetooth | Optional (via. M.2 2230 E Key slot) |
| LTE/4G/ 5G | Optional (via. M.2 3052 B Key slot) |
| Power | |
| Power requirement | 12V DC-in @ 6A |
| Power Supply Type | AT/ATX (default AT mode) |
| Power consumption (typical) | Intel® Core™ i3-N305: 9 – 15W Intel Atom® x7425RE: 12W |
| Environmental & Certification | |
| Cooling | Fanless |
| Operating temperature | 32°F ~ 140°F (0°C ~ 60°C) |
| Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
| Operating humidity | 0% ~ 90% relative humidity, non-condensing |
| MTBF (hours) | 422053 |
| Certification | CE/FCC Class A, RoHS Compliant, REACH |
| Longevity | |
| Longevity | 2038 |
Add-ons
Choose Your SKU
Intel
Core™
i7-1185GRE
HIGH PERFORMANCE
-
15W TDP
-
-40 to 100°C Temp. Range
-
4 Cores
-
1.8 GHz (Turbo up to 4.4 GHz)
-
Intel® Iris® Xe Graphics 96EU
-
In-Band ECC
-
Intel® Programmable Services
Engine (PSE)1 -
Intel® Time-Coordinated
Computing (TCC) -
TPM 2.0 on board
Intel
Atom®
x6425RE
ENTRY LEVEL
-
12W TDP
-
-40 to 85°C Temp. Range
-
4 Cores
-
1.9 GHz
-
Intel® UHD Graphics 32EU
-
In-Band ECC
-
Intel® Programmable Services
Engine (PSE)2 -
Intel® Time-Coordinated
Computing (TCC) -
TPM 2.0 on board
What can you achieve with this kit?
Live Test of Robotic Operation Applications
Run sample applications to perform robotic operations such as object detection, simultaneous localization and mapping (SLAM), navigation, and object avoidance.
Evaluate Applications for Optimization
Collect benchmark data, perform experiments, and evaluate applications as they are developed to optimize any applications running on EI for AMR solutions.
Customize Reference Software for Autonomous Mobile Robots
Modify reference software with artificial intelligence and SLAM algorithms or replace software modules with custom solutions to meet your application needs.
Efficient, Cost-Effective Performance for Industrial Use Cases
Use Cases with Intel
Engineered with Intel® technology, the UP Squared Pro 7000 supports a wide range of applications including AI boxes, Autonomous Mobile Robots (AMR), POS and KIOSK systems, digital signage, and medical devices. With powerful graphics capabilities, flexible I/O connectivity, and enhanced CPU performance, this compact SBC is equipped to handle the demands of modern industrial environments.
To delve deeper into what makes the UP Squared Pro 7000 a standout choice for industrial applications, we recommend Intel’s comprehensive article. See how this innovative SBC delivers efficient and economical performance.
Vertical Markets
INDUSTRIAL AUTOMATION
- Supports standard industry 12V power input power connector
- Real-time technology supported such as TCC, TSN and IBECC
- Industrial COM Port with RS-232/422/485
ROBOTICS
- I/O interfaces include 1x HDMI 2.0b, 2x DP 1.2, 2x USB 3.2 Gen 2, 1x USB 3.2 Type-C
- 40-pin HAT with various industrial I/Os
- WiFi/ BT expansion for wireless connectivity
- Next generation 5G enabled robotics achieving low latency and seamless solutions
RETAIL
- Up to 3x independent displays with efficient video analytics to leverage end user’s shopping behaviour
- AI and IoT enabled for better logistical operations and marketing strategies
- Audio mic-in/out jack for automated audio kiosks and operations
VISION
- Power-efficient CPU and GPU provides AI inference on the edge.
- 5G enabled for next generation Smart Industries and Cities
- Supports OpenVINO for improved AI in Object/intrusion detection, face recognition and monitoring
- Vision expansion options with M.2 ports for additional power for visual applications
Block Diagram
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