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UP Xtreme i14
Introducing the UP Xtreme i14, a groundbreaking industrial-grade maker board that redefines possibilities in embedded computing. Powered by Intel’s latest Intel® Core™ Ultra Processors (formerly Meteor Lake) and featuring Intel® Arc™ Graphics engine, this compact powerhouse measures just 120.35×122.5mm, making it a versatile and space-efficient solution.
Designed for optimal performance, the UP Xtreme i14 supports up to 64GB dual-channel LPDDR5 memory and boasts PCIe Gen 4×4 NVMe via 2x M.2 2280 M-keys, ensuring lightning-fast data transfer and responsiveness.
A standout feature is the inclusion of a 40-pin HAT, reminiscent of the Raspberry Pi board, allowing for flexible configuration into various embedded I/Os such as GPIO, UART, I2C, PWM, I2S, and ADC. This adaptability caters to a wide range of applications, providing developers with unprecedented freedom in customization.
The UP Xtreme i14 doesn’t compromise on display options either, offering up to 4 choices, including HDMI 2.1 and DP 2.1. This versatility ensures seamless integration into diverse projects with varying display requirements.
Elevate your industrial projects with the UP Xtreme i14, where innovation meets compact design and powerful performance, setting new standards in the world of maker boards.
Key Strengths
Powerful Performance
Harness the potential of up to 14 cores and 20 threads with the UP Xtreme i14. Its robust CPU supports low-power domain CPU tile offload, ensuring a staggering 50% SoC power reduction.
Experience unparalleled processing power for your most demanding applications. With up to 64GB dual-channel LPDDR5 memory. Whether you’re handling data-intensive tasks or running multiple applications simultaneously, this maker board ensures seamless and efficient performance.
High-End Graphics
Experience a visual revolution with the UP Xtreme i14, driven by Intel’s cutting-edge Xe graphics engine. Anchored in the new Xe LPG architecture, boasting up to 128 Execution Units (EUs), this graphics powerhouse delivers not just vibrant visuals but also unlocks advanced AI features such as Intel® Deep Learning Boost: DP4a.
What sets it apart is the incorporation of Graphics SR-IOV, Intel’s latest leap in virtualization technologies. Introducing Intel® Graphics Virtualization Technology (Graphics SR-IOV), this feature enables a new level of efficiency, allowing you to seamlessly virtualize graphics resources and enhance the versatility of your projects.
Adaptable I/O Configuration
Dive into a world of customization with the UP Xtreme i14, where versatility is key. Its 40-pin HAT GPIO effortlessly transforms into UART, I2C, PWM, I2S, and ADC interfaces, granting makers the precision to fine-tune their setups. Complementing this, a 10-pin wafer introduces HSUART and 2x USB 2.0 for added connectivity, while two 6-pin wafers offer RS-232/422/485 options, ensuring compatibility across diverse devices and protocols.
Further enhancing control, a 6-pin wafer manages power and reset functions, and a dedicated 4-pin wafer accommodates Smart FAN integration for optimal cooling. The UP Xtreme i14 empowers your projects with an extensive I/O arsenal, making it the go-to solution for crafting tailored, feature-rich embedded systems.
Expandable
- 1x M.2 2230 E-key (CNVI, PCIe and USB) for WiFi/ BT
- 2x M.2 2280 M-key for AI/ Storage
- 1x M.2 3052 B-key with nano SIM slot for 5G
Immersive Visual and Audio Experience
Experience a sensory revolution with the UP Xtreme i14 — up to 2x HDMI 2.1, 1x DP 2.1, and 1x DP 1.4 via USB Type-C to ensure vibrant visuals. A 61-pin MIPI-CSI interface connects seamlessly to expansion boards and cameras, offering a gateway to endless imaging possibilities. The audio jack with mic-in and audio-out completes the experience.
From dynamic displays for digital signage to AI-driven surveillance systems with MIPI-CSI cameras, the UP Xtreme i14 enriches applications in retail, smart cities, and beyond, providing a multisensory edge for your embedded projects
Robust Reliability and Security
With a versatile 9-36V DC input, onboard TPM 2.0, and RTC battery, the UP Xtreme i14 delivers a robust and secure foundation. Its wide input range ensures adaptability across industries, while the onboard TPM 2.0 enhances data security.
The RTC battery ensures uninterrupted clock functionality, making it an ideal choice for resilient and secure embedded applications in diverse settings.
Board Board
Board Details
Hardware overview
- UP Xtreme i14 Series board
- Intel® Arc™ graphics
- 1x Active heatsink
- 1x RTC battery
Tech Specifications
- 40 pin GPIO
- Audio Jack
- USB 4.0 Type C
- Nano SIM Slot
- M.2 3052 B-key
- MIPI-CSI
- 2x RS 232/422/485 pin header
- M.2 2280 M-key
- 2.5 GbE LAN
- GbE LAN
- DP
- HDMI
- USD 2.0 Type A
- HDMI
- 2x USB 3.2 Type A
- 9 – 36V DC-in Power Jack
- Power Button
- Front Panel
- M.2 2230 E-key
- USB 2.0 / UART pin header
- SATA
- SATA power
- m.2 2280 M-key
- FAN
| SoC | 14th Gen Intel® Core™ Processor SoC (formerly Meteor Lake) |
| # of Cores | Up to 14 cores |
| Graphics | Intel® Arc™ graphics / Intel® Graphics |
| System memory | Onboard LPDDR5 up to 64GB (Dual Channel) |
| Storage capacity | 1x SATA III port
2x M.2 2280 PCIe Gen 4×4 M-key (NVMe* support) |
| FPGA | |
| BIOS | UEFI |
| RTC | Yes |
| Wake-on-LAN (WoL) | Yes |
| Watchdog timer | Yes |
| PXE | Yes |
| TPM | TPM 2.0 on board |
| Compatible operating system | Windows* 10 Enterprise 2021 LTSC
Ubuntu 22.04 Yocto 4.0 |
| Dimension (L x W) | 4.7″ x 4.8″ (120.35 mm × 122.5 mm) |
| Display | |
| HDMI | 2x HDMI 2.1 |
| DP | 1x DP 2.1
1x DP 1.4 via USB Type-C |
| MIPI DSI/eDP | – |
| I/O | |
| USB | 2x USB 2.0 via 10-pin wafer
1x USB 2.0 Type-A 3x USB 3.2 Gen 2 Type-A 1x USB 4.0 Type-C |
| Audio | 1x Audio Jack (Mic-in, Line out) |
| Camera | 2x 4-Lane MIPI-CSI via 61pin FPC connector |
| UART | 1x HSUART via 10-pin wafer |
| Serial port | 2x RS-232/422/485 10-pin header |
| Expansion slot | 2x M.2 2280 M key (PCIe Gen 4×4),
1x M.2 2230 E key (PCIe/ USB/ CNVi) 1x M.2 3052 B Key (PCIe/ USB 3.0) with Nano SIM slot |
| 40-pin HAT | 1 |
| Others | 1x 4-pin wafer for Smart FAN
3x status LEDs (YRG) |
| Connectivity | |
| Ethernet | 1x GbE (Intel® i219)
1x 2.5GbE (Intel® i226IT) |
| WiFi 5/6 | Optional (via. M.2 2230 E Key slot) |
| Bluetooth | Optional (via. M.2 2230 E Key slot) |
| LTE/4G/ 5G | Optional (via. M.2 3052 B Key slot) |
| Power | |
| Power requirement | 9~36V DC-in |
| Power Supply Type | AT/ATX |
| Power consumption (typical) | TBD |
| Power & Reset | 1x Power button with LED
1x 6-pin power & reset wafer |
| Environmental & Certification | |
| Cooling | Active cooling |
| Operating temperature | 32°F ~ 140°F (0°C ~ 60°C) |
| Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
| Operating humidity | 0% ~ 90% relative humidity, non-condensing |
| MTBF (hours) | TBD |
| Certification | CE/FCC Class A, RoHS compliant |
| Longevity | |
| Longevity | 2039 |
Choose Your SKU
Intel
Core™
i7-1185GRE
HIGH PERFORMANCE
-
15W TDP
-
-40 to 100°C Temp. Range
-
4 Cores
-
1.8 GHz (Turbo up to 4.4 GHz)
-
Intel® Iris® Xe Graphics 96EU
-
In-Band ECC
-
Intel® Programmable Services
Engine (PSE)1 -
Intel® Time-Coordinated
Computing (TCC) -
TPM 2.0 on board
Intel
Atom®
x6425RE
ENTRY LEVEL
-
12W TDP
-
-40 to 85°C Temp. Range
-
4 Cores
-
1.9 GHz
-
Intel® UHD Graphics 32EU
-
In-Band ECC
-
Intel® Programmable Services
Engine (PSE)2 -
Intel® Time-Coordinated
Computing (TCC) -
TPM 2.0 on board
What can you achieve with this kit?
Live Test of Robotic Operation Applications
Run sample applications to perform robotic operations such as object detection, simultaneous localization and mapping (SLAM), navigation, and object avoidance.
Evaluate Applications for Optimization
Collect benchmark data, perform experiments, and evaluate applications as they are developed to optimize any applications running on EI for AMR solutions.
Customize Reference Software for Autonomous Mobile Robots
Modify reference software with artificial intelligence and SLAM algorithms or replace software modules with custom solutions to meet your application needs.
Vertical Markets
The powerful CPU, extensive I/O options, and secure design make the UP Xtreme i14 ideal for industrial automation applications, offering the processing power and connectivity needed for control systems and data acquisition.
With its compact form factor, robust performance, and diverse I/O configurations, the UP Xtreme i14 is well-suited for edge computing applications, providing the necessary computational power for data processing at the source.
The board’s impressive visual features, including HDMI 2.1 support and MIPI-CSI interface, make it an excellent choice for digital signage and retail applications, enabling vibrant displays and multimedia content.
Leveraging the MIPI-CSI interface, the UP Xtreme i14 can be utilized in surveillance systems with AI capabilities, providing high-quality imaging and processing for video analytics in security applications.
The board’s graphical capabilities and MIPI-CSI interface make it suitable for medical imaging applications, facilitating the development of innovative solutions in areas such as diagnostics and telemedicine.
With its broad power input range, resilient design, and diverse connectivity options, the UP Xtreme i14 is well-suited for smart city applications, ranging from intelligent transportation systems to environmental monitoring and infrastructure management.
Block Diagram
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