Get 5G Ready with New Carrier Board from UP! Bridge the Gap

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Get 5G Ready with New Carrier Board

(Eindhoven, The Netherlands – 30/06/2021) UP! Bridge the Gap, a brand belonging to a professional embedded computing ODM AAEON Technology Europe, has introduced the UP Connect Plus, their latest carrier board designed to add 5G capability to the UP Core Plus and UP Xtreme platforms.

As technology advances, businesses depend more on smart applications powered by Artificial Intelligence (AI) as well as a large Internet of Things (IoT) ecosystem to monitor, manage, and secure their business operations.

The increased amount of network traffic and massive amounts of data being transferred means that companies are looking for new ways to seamlessly connect their devices to the cloud. The introduction of 5G delivers greater network reliability, larger IoT device bandwidth, higher data speeds, and lower latency than 4G/LTE networks.

UP Connect Plus
UP Connect Plus

UP Connect Plus

UP! Bridge the Gap is meeting the growing demand for the 5G network by providing a 5G compatible port via the M.2 3042/3052 colay on the UP Connect Plus. Customers can add a 5G module card to the UP Connect Plus, available soon in the UP Shop. Pair the UP Connect Plus with the UP Core Plus and UP Xtreme platforms to bring astonishing 5G speeds to any application.

UP Connect Plus also offers three additional Gigabit LAN ports to extend functionalities of the UP Core Plus and UP Xtreme platforms. UP! Bridge the Gap is offering customers the choice between two types of Intel® Ethernet ports that deliver gigabit speeds.

The UP Connect Plus i211 has three Intel® Ethernet Controller I211-AT ports for transmitting 1GB per second. For industrial applications that require synchronization and precision timing, the UP Connect Plus i210 offers three Intel® Ethernet Controller I210-IT ports with Time Sensitive Networking (TSN) support and a wide temperature range.

Developers can use TSN together with real-time features on Intel® architecture to synchronize networks of devices for improving the timely behavior of industrial systems. Smart factories, mobile and collaborative robots, autonomous systems, and virtual/mixed reality are a few examples that rely on accurate time and bounded (low) latency computing and communications.


UP Connect Plus Specifications:

  • Supports 5G module (M.2 3042/3052 colay) with micro-SIM card port
  • 3x Intel® Ethernet Controller I210-IT (wide temperature and TSN) OR 3x Intel® Ethernet Controller I211-AT
  • USB 3.0 Type A (UP Core Plus only)
  • 1x 2 channel PCIe Switch
  • Operating temperature: 32°F ~ 140°F (0°C ~ 60°C)

Compatible with UP Core Plus and UP Xtreme Platforms

The UP Connect Plus can be connected to the UP Core Plus and UP Xtreme platforms via the dual 100-pin docking connector. Please refer to the UP Connect Plus Quick Start Guide for assistance with getting started.

The UP Core Plus platform is a versatile, ultra-compact, and fanless edge computing module. It is approximately the size of a credit card, but it boasts high performance and low power consumption. Powered by the Intel Atom® x5-E3930, x5-E3940, x7-E3950 processors (formerly Apollo Lake), it comes with up to 8GB of LPDDR4 memory onboard and up to 128GB of eMMC storage onboard. Besides the four RJ-45 ports each with an individual networking chip, it also comes with an additional mPCI-e slot and SATA connector.

The UP Xtreme platform delivers higher performance and processing power to enable AI applications on edge devices. It is powered by the 8th Generation Intel® Core™ processors i3/i5/i7 & Celeron CPU (formerly Whiskey Lake) and can clock up to 4.6 GHz using only 15W TDP. Pair the UP Xtreme with the AI Core X to accelerate the power of AI inference on the edge.


Accelerate AI on the Edge

The 5G network will unleash artificial intelligence capabilities at the edge. With a combination of powerful accessories (the AI Core X and the UP Connect Plus), customers can build next-generation AI Edge technology with the UP Xtreme platform.

The AI Core X is powered by Intel® Movidius™ Myriad™ X VPUs to drive the demanding workloads of modern computer vision and AI applications at ultra-low power. It is available in various sizes including Mini Card/mPCIe, M.2 2280, and custom form factors with single and multiple chips. With just a few watts of power consumption, each chip delivers up to four trillion operations per second (TOPS) with a Neural Compute Engine capable of delivering up to one TOPS.

The introduction of the 5G network to the UP Xtreme platform, via the UP Connect Plus, will bring seamless connectivity between the edge and cloud, enabling data processing in near real-time. As 5G can support more IoT devices, the increased amount of insight and data will provide a solid foundation for AI to evolve. AI applications will be able to make better decisions, in less time and with more accuracy.


Third Generation Carrier Board

The UP Connect Plus is the third generation of carrier board for the UP Core Plus and UP Xtreme platforms.

The first-generation carrier board, UP Net Plus, features four Gigabit LAN powered by Intel® i211-AT or Intel® i210-IT (TSN support on i210-IT), as well as mPCIe to host an AI Core or 3G/4G modem, SATA, and USB 3.0 port.

The second-generation carrier board, UP Vision Plus X, is a vision accelerator with three Movidius Myriad X VPU to leverage the AI inferencing power of the main boards.


UP Connect Plus Available Now

The UP Connect Plus is available now for purchase in the UP! Bridge the Gap web shop (, with prices starting from $84. The UP Shop offers worldwide, seven-day shipping on available stock. Visit the UP Shop to order the UP Connect Plus today and get it shipped directly to your door within one week, while supplies last.


Solution Partners with UP! Bridge the Gap

Success in the AI & IoT world cannot be done alone, so UP! Bridge the Gap has built an ecosystem of valued partners. UP! Bridge the Gap collaborates with partners to provide end-to-end solutions tailored for different vertical markets. Eco-partners have early access to the latest hardware and can join co-marketing campaigns. Join the UP! Ecosystem and enjoy the related benefits by signing up as a partner today.


Customize your UP! Bridge the Gap Platform

UP! Bridge the Gap offers the ability to customize the BIOS on all UP platforms. Customers can change the logo by purchasing the UP BIOS Splash Service and change pre-settings for the UP Core Plus by purchasing the BIOS Pre-Setting.


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About UP! Bridge the Gap

Founded by AAEON Technology Europe in 2015, UP Bridge the Gap aims to bring innovation in technology, business model, and integrated solutions. With its agility, the UP team collaborates with market leaders in different vertical markets to bring integrated solutions. It continues to grow a large online community to work closely with developers.


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